GEIA HB 0005 2 PDF
Buy GEIA HB (R) Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead-Free Solder And Finishes. Find the most up-to-date version of GEIA-STD at Engineering TechAmerica GEIA-HB Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder.
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This standard is not included in any packages. Plated brass, tin-plated brass with a copper barrier layer, tin plated steel, tin-plated steel with a copper barrier layer, all displayed their own characteristics, sometimes predictable, sometimes not, but fused tin plating showed no whisker nucleation on any of these substrates during the 32 years of the bh.
Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1
An additional test vehicle had been designed, based on a PCB with 24 SOIC14 packages, assembled using range of techniques, to enable testing for short circuits between adjacent leads on individual component. Proceed to Checkout Continue Shopping. There had been a move away from component termination material type, structure and processing as specific mitigation strategies.
Dr Ashworth stressed that these observations related to the particular proprietary electroplating chemistry used in the study, and that gea commercial formulations might demonstrate different relationships between current density, deposit microstructure and whisker growth. Each batch of eight boards was delivered to consortium partners for coating and returned to NPL for testing.
It will take a combination of high-level design strategies and an effective set of guidelines to enable the ADHP engineer to develop mission-successful products and systems.
Level 3, which was relevant to equipment designed to be sent into space, 005 the use of pure tin finishes. On behalf of ESA, a working group led by Dr Dunn had produced a comprehensive set of guidelines for creating a lead-free control plan, which described the problems, requirements and methods relevant to the preparation of a plan for companies to control against 00055 use of lead-free components and to ensure that pure tin did not find its way into the manufacturing chain.
You can download and open this file to your own computer but DRM prevents opening this file geix another computer, including a networked server.
geia std 2 pdf – P(1) –
A remarkable observation was that in some instances it could be several years before gei began to grow, depending on the substrate and stress level. While the Pb-free movement may appear ominous and challenging, there are tools and resources available to the designer. Cawthorne reviewed the definitions of the mitigation control levels defined in GEIA-STD, commenting that the required level would normally be a function of the design authority in consultation with the customer, and that military applications would typically expect mitigation hbb at least Level 2B—risks managed primarily through mitigations, including design rules, and more likely 2C—risks managed more by avoidance and less by mitigation.
Finishes to be avoided were silver, plated tin-copper, any tin plating over brass without a copper or nickel barrier, and bright tin.
Using a tin plating process deliberately chosen for it high propensity to whiskering, NPL had geua a parallel plate test vehicle that had been enabled electrical detection of failure.
Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards. The factors influencing whisker growth were electroplating bath chemistry, whether pure tin or a tin alloy, bright or matte, electroplating parameters such as current density, temperature and agitation, and substrate, taking copper, brass and alloy 42 as examples.
Although equipment designed to go into space was exempt from the RoHS Directive, the reliability of space projects clearly depended on nb integrity of PCBs, components and assembly processes. Furthermore, the guide highlights Pb-free concerns, as they are encountered in the phases which generally reflect the product development cycle used by Aerospace, Defense, and High-Performance systems industries.
Other resources include work performed in hhb benchmark the Pb-free technical knowledge base as well as gwia a roadmap and plan to close those technical data gaps [13, 14].
Living With PB-Free in High Performance Engineering Design
You may delete gia document from your Alert Profile at any time. The focus is to provide insight and information such that the design will maintain performance requirements for aerospace, defense, and high-performance ADHP products and systems.
Nine batches had been built to date, together with control assemblies with no coating, all of which had shown extensive whiskering before any evidence was seen on the coated examples. He began his presentation on problems associated with whisker growths with a remarkable time-lapse video recorded by researchers at Brown University, showing the initiation and growth of a tin whisker at a steady rate of about 1 micron per hour over a period of 40 hours.
But how do we set about mitigating against gdia failure where the use of pure tin finished components is unavoidable? Finally, a good number of texts and a continuously increasing amount of data is now available in the open literature.
Although higher currents would cause instant burn-out, in high-vacuum conditions a short circuit could result in a plasma discharge. Tin Whisker Mitigation Methodologies: As the voice of the U. This paper presents a summary of efforts from document inception to document release. The geis included a list of tasks necessary to provide ADHP engineers sufficient information to minimize risks associated with Pb-free solders and finishes.
The higher current densities tended hh favour the formation of large eruptions, rather than filament whiskers. Martin Wickham reviewed previous findings and gave an update on current work.
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